India opens Semicon 2.0 applications and will accept only complete files

According to ThePrint, the portal takes applications for three of the programme's 6 pillars: chipmaking machinery and materials, new fabrication plants, and ATMP/OSAT, meaning assembly, testing and packaging. Vaishnaw said the government wanted only serious players with technological capability and that there was no room for placeholder applications. According to Indian Defence News, the ministry will consider only complete applications. The goal is to attract at least 3 major equipment makers and 5 chemical and gas companies to India.

The 12 component projects approved the same day envisage output of 39,045 crore rupees and 7,127 direct jobs. According to KNN India, copper foil, cathode active material and specialty ceramics received incentives for the first time in this round; the copper foil application came from Indo Asia Copper. The number of projects approved under the components programme has risen to 118, with investment of 77,051 crore rupees and projected output of 5.73 lakh crore rupees. About 50% of the projects are SMEs.

The constraint lies not in the 1.275 trillion rupee subsidy but in inputs. In the first phase, 12 semiconductor projects with investment of more than 1.64 lakh crore rupees were approved across 6 states, but as of October 2026 only 5 had begun commercial production. By putting the machinery and materials pillar first, phase 2 shows the bottleneck shifting from assembly to equipment and chemical inputs. China issued 6 restriction notices on 9 October 2025 and suspended them until 10 November 2026; one covers rare earth equipment and materials. How far Indian projects are affected by that suspension could not be verified.